Publications of Dr. Sebastian Koeber

Journals

Conferences

'Silicon-organic hybrid (SOH) frequency comb source for data transmission at 784 Gbit/s,'  ;
Weimann, C.; Wolf, S.; Korn, D.; Palmer, R.; Koeber, S.; Schmogrow, R.; Schindler, P.; Heni, W.; Bekele, D.; Elder, D.; Yu, H.; Bogaerts, W.; Dalton, L.; Freude, W.; Leuthold, J.; Koos, C.:
39^th European Conf. Opt. Commun. (ECOC'13), London, UK, Paper Th.2.B.1; Sept 22–26, 2013

'High-speed silicon-organic hybrid (SOH) modulator with 1.6 fJ/bit and 180 pm/V in-device nonlinearity,'
Palmer, R.; Koeber, S.; Heni, W.; Elder, D.; Korn, D.; Yu, H.; Alloatti, L.; Koenig, S.; Schindler, P.; Bogaerts, W.; Pantouvaki, M.; Lepege, G.; Verheyen, O.; Van Campenhout, J.; Absil, P.; Baets, R.; Dalton, L.; Freude, W.; Leuthold, J.;
39^th European Conf. Opt. Commun. (ECOC'13), London, UK, Sept 22–26, 2013 (invited). Paper We.3.B.3

'Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration,';
Koos C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Huebner, P.; Billah, M.: OSA Integrated Photonics Research, Silicon and Nanophotonics (IPR'13); Paper IM4A.3; Rio Grande, Puerto Rico, USA, July 14–17, 2013 [invited

'Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography,'
Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Huebner, P.;
15^th Intern. Conf. on Transparent Optical Networks (ICTON'13), Cartagena, Spain, Paper We.C2.4
June 23–27, 2013 (invited)
doi: 10.1109/ICTON.2013.6602977

'Photonic wire bonding: Connecting nanophotonic circuits across chip boundaries',
Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Huebner, P.; Hillerkuss, D.; Schmogrow, R.;
MOEMS-MEMS SPIE Photonics West (MOEMS-MEMS-SPIE'13), San Francisco (CA), USA, Feb. 2-7, 2013, paper 8613-31[invited]
doi:10.1117/12.2003096