Publications of type Inproceedings
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Conference Contributions (24)
- Maier, P.; Xu, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
InP/Si3N4 Hybrid External-Cavity Laser With sub-kHz Linewidth Acting as a Pump Source for Kerr Frequency Combs
European Conference on Optical Communication (ECOC), Basel, Switzerland, Sept. 18-22 , paper We2E.4 (2022) more - Maier, P.; Xu, Y.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Trappen, M.; Kind, T.; Weber, A.; Blaicher, M.; Dietrich, P.-I.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly
Optical Fiber Communications Conference and Exhibition (OFC); San Diego, CA, USA, March 06–10 , paper W2A.1 (2022) [DOI] more - Trappen, M.; Dietrich, P.-I.; Burger, P.; Blaicher, M.; Goering, G.; Schimmel, T.; Freude, W.; Hoelscher, H.; Koos, C.
AFM engine with optical actuation and readout printed on the facet of a multi-core fiber
Conference on Lasers and Electro-Optics (CLEO), San Jose (CA), USA, May 10-15 , paper SM2N.7 (2020) more - Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Conference on Optical Fiber Communication (OFC), San Diego, CA, USA, March 08– 12 , paper M4H.6. (2020) [DOI] - Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Optical Fiber Communication Conference (OFC), San Diego (CA), USA, March 08–12, paper M4H.6 (2020) more - Su, Y.; Trappen, M.; Blaicher, M.; Koos, C.; Nahm, W.
A 3D resolution and aberration test target for confocal laser endomicroscopy
SPIE BiOS 2020, San Francisco (CA), USA, Feb. 01-03 , 11229 (2020) [DOI] - Freude, W.; Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Wolf, S.; Weber, M.; Boes, F.; Massler, H.; Tessmann, A.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Globisch, B.; Walther, M.; Zwick, T.; Randel, S.; Koos, C.
Wireless Terahertz Communications
Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), pp. 1-1 , paper 8873098 (2019) [DOI] - Freude, W.; Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Wolf, S.; Weber, M.; Boes, F.; Massler, H.; Tessmann, A.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Goebel, T.; Walther, M.; Zwick, T.; Randel, S.; Koos, C.
Terahertz communications meets photonics
14th Intern. Conf. on Fiber Optics & Photonics (Photonics'18), Indian Institute of Technology Delhi (IIT Delhi), Delhi, India, December 12–15 (2018) (invited) - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
3D-Printed Optics for Wafer-Scale Probing
44th European Conference on Optical Communication (ECOC), Rome, Italy, September 23-27, paper Tu4C.2 (2018) [DOI] - Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited) - Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited) - Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more - Kohler, D.; Wondimu, S. F.; Hahn, L.; Allegro, I.; Blaicher, M.; Freude, W.; Koos, C.
Lasing in Si3N4-Organic Hybrid (SiNOH) Spiral Resonators
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper SM4I.6 (2018) [DOI] more - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI] - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited) - Harter, T.; Adib, M. M. H.; Wolf, S.; Muehlbrandt, S.; Weber, M.; Blaicher, M.; Boes, F.; Massler, H.; Tessmann, A.; Nellen, S.; Goebel, T.; Giesekus, J.; Walther, M.; Zwick, T.; Freude, W.; Randel, S.; Koos, C.
Wireless Multi-Subcarrier THz Communications Using Mixing in a Photoconductor for Coherent Reception
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper MA4.2 (2017) [DOI] - Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline) - Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline) - Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI] - Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI] - Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more