Publications of type Lecture

Lectures (10)

• Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
  3D Printing for Advanced Photonic Integration
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)


• Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
  Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
  Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
  EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)


• Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
  115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)


• Nesic, A.; Alloatti, L.; Pfeifle, J.; Lindenmann, N.; Leuthold, J.; Freude, W.; Koos, C.
  Highly Efficient Silicon-Organic Hybrid (SOH) Phase Shifters for Reconfigurable Ultra-Fast Signal Processing
  International Nano-Optoelectronics Workshop iNOW-2013, August 19-30 , Cargèse, France (2013)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
  Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
  13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Pfeifle, J.; Schindler, P. C.; Hillerkuss, D.; Schmogrow, R.
  Silicon-Organic Hybrid Integration and Photonic Wire Bonding: Technologies for Terabit/s Interconnects
  Joint Symposium on Opto- and Microelectronic Dvices and Circuits (SODC2012), Hangzhou, China, Sept. 24-27 (2012) (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Lindenmann, N.; Palmer, R.; Pfeifle, J.; Hillerkuss, D.; Schmogrow, R.
  Silicon Nanophotonics and Photonic Wire Bonding: Technologies for Terabit/s Interconnects
  6th ITG Workshop on Photonic Integration, Laser Optics Berlin, March 20 (2012) (invited)