Publications of 2014

Conference Contributions (2)

• Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
  Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
  Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]


• Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
  Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
  SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited)

Lectures (4)

• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
  Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
  EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)


• Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
  115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)