Publications of 2016

Journal Articles (2)

• Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
  Tailored probes for atomic force microscopy fabricated by two-photon polymerization
  Applied Physics Letters 109, 063101 (2016) [DOI]


• Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
  Optical coherence tomography system mass-producible on a silicon photonic chip
  Opt. Express 24, 1573-1586 (2016) [DOI]

Conference Contributions (3)

• Freude, W.; Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Koos, C.
  Silicon photonic integrated circuit for optical coherence tomography
  18th Intern. Conf. on Transparent Optical Networks (ICTON'16), Trento, Italy, July 10-14 , paper Tu.C5.1 (2016) [DOI] (invited)


• Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
  Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
  Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]


• Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
  Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

Lectures (1)

• Freude, W.; Schneider, S.; Weimann, C.; Hoeller, F.; Lauermann, M.; Dietrich, P.-I.; Koos, C.
  Integrated optics for optical coherence tomography and surface topography characterization
  Light: Science & Applications, Light Conference (Light Conference'16, Speakers), Changchun, China, July 4-8 (2016) (invited)