Publications of type Inproceedings
List publications according to yearAll | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | 2014 | 2013 | List publications according to typeAll | Journal Articles | Conference Contributions | Lectures | Workshops |
Conference Contributions (24)
- Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Conference on Optical Fiber Communication (OFC), San Diego, CA, USA, March 08– 12 , paper M4H.6. (2020) [DOI] - Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Optical Fiber Communication Conference (OFC), San Diego (CA), USA, March 08–12, paper M4H.6 (2020) more - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
3D-Printed Optics for Wafer-Scale Probing
44th European Conference on Optical Communication (ECOC), Rome, Italy, September 23-27, paper Tu4C.2 (2018) [DOI] - Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited) - Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited) - Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI] - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited) - Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline) - Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline) - Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI] - Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 , paper 7483033 (2016) [DOI] (invited) - Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI] - Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more - Koos, C.; Freude, W.; Leuthold, J.; Kohl, M.; Dalton, L. R.; Bogaerts, W.; Lauermann, M.; Wolf, S.; Weimann, C.; Melikyan, A.; Lindenmann, N.; Billah, M. R.; Muehlbrandt, S.; Koeber, S.; Palmer, R.; Koehnle, K.; Alloatti, L.; Elder, D. L.; Giesecke, A. L.; Wahlbrink, T.
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform
28th Annual Conf. of the IEEE Photonics Society (IPC'15), Reston (VA), USA, Oct. 4–8 , paper MF2.1 (2015) [DOI] (invited) - Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI] - Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI] - Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 , paper 7483033 (2013) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)