Publications of 2016

Conference Contributions (3)

• Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
  Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
  Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]


• Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
  Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
  Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 , paper 7483033 (2016) [DOI] (invited)


• Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
  Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]