Publications of 2020

Journal Articles (2)

• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Dankwart, C.; Xu, Y.; Hoose, T.; Billah, M. R.; Abbasi, A.; Baets, R.; Troppenz, U.; Theurer, A.; Woerhoff, K.; Seyfried, M.; Freude, W.; Koos, C.
  3D-printed optical probes for wafer-level testing of photonic integrated circuits
  Opt. Express 28, 37996-38007 (2020) [DOI]


• Blaicher, M.; Billah, M. R.; Kemal, J. N.; Hoose, T.; Marin-Palomo, P.; Hofmann, A.; Kutuvantavida, Y.; Kieninger, C.; Dietrich, P.-I.; Lauermann, M.; Wolf, S.; Troppenz, U.; Moehrle, M.; Merget, F.; Skacel, S.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
  Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
  Light Sci. Appl 9, 71 (2020) [DOI] more

Conference Contributions (2)

• Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
  InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
  Conference on Optical Fiber Communication (OFC), San Diego, CA, USA, March 08– 12 , paper M4H.6. (2020) [DOI]


• Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
  Optical Fiber Communication Conference (OFC), San Diego (CA), USA, March 08–12, paper M4H.6 (2020) more