Publications of type Lecture

Lectures (9)

• Koos, C.; Kippenberg, T. J.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Fang, D.; Drayss, D.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Fuellner, C.; Billah, M. R.; Blaicher, M.; Xu, Y.; Lauermann, M.; Skacel, S.; Lihachev, G.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Mueller, J.
  Terahertz Analogue-to-Digital Conversion Using Soliton Frequency Combs and Massively Parallel Spectrally Sliced Detection (TeraSlice)
  International Workshop on Mobile THz Systems (IWMTS), online event, Duisburg, Germany, July 5 – 7 (2021) (invited)


• Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton, L. R.; Zwickel, H.; Kieninger, C.; Wolf, S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiu, F.; Elder, D. L.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
  Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials
  IEEE CPMT Symposium Japan (ICSJ 2019); Kyoto, Japan, November 18-20 (2019) (invited)


• Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
  Photonic Wirebonding - from Lab to Fab
  OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017)


• Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
  3D Printing for Advanced Photonic Integration
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
  Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
  EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)


• Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
  115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)